The challenge

Scatterometry is an established optical method for measuring the full profile of a structure in a fast and cost effective manner. An alternative, in part, to CDSEM, scatterometry procedures are typically complex requiring software that can interpret intensity signals as a function of wavelength and easily generate information useful to the end-user. To do this, the software must be fully automatic and provide fast and easy application development at a variety of user levels, with a single, best output of scatterometry solution. It must combine the best of two worlds: allow fast and automatic application development. And have infinite flexibility for the treatment of all types of structures and layouts on a wafer. The resulting application should allow very fast and precise metrology measurements on complex structures as required in high volume production.

The integration of such software with specific hardware products should deliver the best metrology output and best measurement capabilities for industry measurement needs including CD control, thickness, and etch depths. It should be able to interpret signals denoting parameters that CDSEM can not “see”, such as sidewall angles, an undercut beneath the gate, a foot, a notch, and other profile and shape information. And finally, the software should provide a modeling solution that works at the production level, because scatterometry is a production tool.

Solution: NovaMARS Software

Metrology Analysis and Recipe Set-up, NovaMARS software embodies these rigorous requirements, making Nova’s scatterometry-based NovaScan 3090 process control systems both powerful and user-friendly. Together they provide a tight hardware-software integration to allow the end-user full benefit of the metrology tool capabilities. Process Oriented Modeling Flexibility (POMF) enables easy modeling and recipe creation of scatterometry overlay, direct in-die measurements and advanced lithography OPC structures. Unique algorithms allow material characterization such as n & k measurements in patterned and solid sites. Comprising simplicity and automation,  with the ability to measure complex structures takes application development to new heights.

Application development options:
· Real time regression
· Library based solutions

Accelerated calculation options:
· High Power Computation (NovaHPC)
· Grid distributed computing over the network

Key Benefits: 
· User friendly
· Full automation for recipe setup
· Infinite flexibility enabling 2-D and 3-D profiling
· Easy modeling and recipe creation for advanced OPC structures
· Direct in-die measurements
· Enables high throughput of complex measurements